Company

Opened in 1997, KLA-Tencor China is a mission-critical operating unit of KLA-Tencor (NASDAQ: KLAC), with offices in Shanghai, Beijing, Tianjin, Suzhou, Wuxi, Wuhan and Dalian. KLA-Tencor is a leading provider of process control and yield management solutions and has created superior solutions for more than 35 years, serving the semiconductor, data storage, LED, photovoltaic and other related nanoelectronics industries.

Demonstrated by our long-standing presence and continued growth within the region, KLA-Tencor remains a committed partner to customers throughout China, helping them reduce their operating costs and increase profitability.

KLA-Tencor’s ICOS division, located in Hong Kong and Shenzhen, is responsible for the development, production, and sales of a series of defect inspection systems for various applications in the semiconductor and solar industries. Our Component Inspector (CI) products inspect semiconductor components, such as microprocessors or memory chips, and the Photovoltaic Inspection (PVI) products perform cosmetic inspections on multi-crystalline solar cells.

With over 6000 employees and additional offices throughout the world in the United States and Europe, KLA-Tencor is always looking for new talent to expand the team. While working alongside some of the brightest minds and most advanced technical equipment, our career development opportunities will keep you intellectually challenged and inspired.

KLA-Tencor provides a portfolio of defect inspection tools and detection products to help LED manufacturers ramp production yields, improve quality, and enable a more cost-effective manufacturing process.

KLA-Tencor’s comprehensive LED process control tools and products helps drive down the cost per lumen by supporting:

  • Quality control and process yield improvement starting from substrate growth, epitaxial process and patterning to dicing by monitoring surface pattern, as well as dicing defects, to maximize process tool performance and yield throughout manufacturing.
  • Fast automated excursion defect inspection and detection to enable prompt corrective actions and reduce wafers-at-risk.
  • Variable wafer size configurations (2” to 8”) to support different customer needs.